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Hitachi High Technologies America, Inc.

Hitachi

SiP Mounter

CM-700X

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CM-700X
SiP Mounter

SMT Quotation/Information Request
  • Precision accuracy coupled with high speed this SiP mounter for CSP and LOC assemblies has 300mm wafer handling capability.
Item Description
Bonding Speed

BOC/LOC: 1.0sec/die
μBGA/CSP: 1.9sec/die
Depends on bonding condition
Bonding Accuracy BOC/LOC: X-Y ±38μm (3σ)
μBGA/CSP: X-Y ±8μm (3σ)
Work Dimension Lead Frame Width: 25-90mm
Length: 145-250mm
Wafer 300mm standard, 200mm optional
Die 3x3mm-25x25mm
Dimensions 2,370Wx1,420Dx1,720H(mm)
Weight 2,500kg

 

  • Handling capability of 300mm and 200mm wafers
  • Handles μBGA/BOC assemblies for next-generation DRAM packages.
  • Flexible die mount mode selections are available for a variety of packages.
  • "μBGA" is a registered trademark of Tessara Technologies, Inc.
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