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Hitachi High Technologies America, Inc.

Hitachi

CG4000 Scanning Electron Microscope

CG4000
CG4000 Scanning Electron Microscope

CG4000 High performance CD-SEM for 45nm / 32nm generation and beyond.
Basic performance has been enhanced through a completely redesigned platform

Basic performance improvement
Hitachi has improved the system platform to achieve our best performance.

Resolution : 1.8nm (@800V)
Measurement repeatability: 0.3nm (3σ, Hitachi standard wafer)

DBM (Design Based Metrology)
Hitachi's DesignGauge system, is capable of generating waferless, design-based recipes.  This system's ability to measure differences between the intended pattern (design data) and the actual pattern printed on the wafer is very useful when evaluating Optical Proximity Correction (OPC) model effectiveness.

Yield Enhancement
1) High accuracy process monitor

Hitachi increased the number of pixels for the SEM image and applied the ACD (Averaged CD) function. The increased number of pixels has enabled ACD measurement of a large number of features under low magnification with the same measurement accuracy as those at high magnification. This function has proven to be effective for both resist and etched multi-layer patterns. The measurement results can be made available immediately for implementation of feed forward and/or feedback loops to production tools. This capability contributes greatly to productivity improvement, yield enhancement, and provides our customers with a new paradigm for process monitoring.
2) Off-Line recipe creation

In conjunction with Hitachi's DesignGauge system, the CG4000 is able to execute a design data based measurement recipe. With this function, tremendous savings in tool time can be achieved over conventional recipe writing which further contributes to improved tool productivity and fleet efficiency.

Wafer Size 300mm (200mm)
Resolution 1.8nm (Accelerating voltage: 800V)
Repeatability ±1% or 0.3nm (3 sigma) (With Hitachi standard wafer )
Autoloader 2 or 3 FOUPs random access
Throughput 36 wafers / hour (20-measurement points on wafer)