Hitachi's 700-Series Dry Plasma Etcher

• Bridge Tool
• High Uptime/High Reliability/Low DD
• 2 Etch Chambers
• 2 Ash Chambers
• 200mm and 300mm Wafer Size
• FOUP or Open Cassette
• Fully Flexible Chamber Flow Programming
• Dedicated Load/Unload Ports
• Fully AGV, OHV Capable
•  Windows NT Software

The 700-Series platform is designed for the stringent requirements of 300mm wafer production but provides backwards compatibility for 200mm operations. With its FOUP interface, the 700-Series provides the ultra-clean wafer environment necessary for very low DD and higher yields.

The platform is a multi-chamber system offering two etch chambers and two optional ash chambers. The 700-Series may be configured with either the Microwave ECR etch chamber, the UHF ECR etch chamber, or the EMCP chamber.