Hitachi's 500-Series Dry Plasma Etcher

• Microwave ECR/EMCP Chamber Options
• High-Performance Process Capability
• 1 Etch Chamber
• 1 Ash Chamber (optional)
• Factory Integration
• 125mm – 200mm Wafer Size
• Open Cassette Interface
• Dedicated Load/Unload Ports

Hitachi’s 500-Series etch platform is a high performance system for enabling processing to the sub-200nm node. It is a cost-effective single-chamber system that can incorporate either the high-density Microwave ECR chamber or the specialized non-volatile EMCP etch chamber.

The 500-Series provides a three-wafer cassette interface and separate load and unload locks. The platform is configured with one etch chamber, an optional ash chamber, and an optional on-board rinse station in the EMCP version.