SMI-ED Multi-layer ceramic and plastic packages
Sumitomo Metal Electronic Devices, Inc., (SMI-ED) manufactures multi-layer ceramic packages suitable for subscriber (up to 10G) and trunkline (up to 40G) applications.
8 lead mini-DIL
- 14 lead butterfly
- GPO package
- Plastic Packages
- Responding to the increased need for higher frequency and higher power devices, SMI-ED utilizes a variety of simulation and evaluation tools to optimize package design. Dimensional stability and hermetic reliability are obtained through consistently reproducible production methods.
Hitachi High Technologies America is SMI-ED's sales and marketing representative for North America.
Advantages:
- Electrical Simulation (e high frequency signal transmittable characteristics)
- Stress Simulation (e stress analysis between lens and low melting temperature glass solder during the lens attachment process)
- Thermal Characterization and Modeling
Applications:
| 8 Lead Mini DIL |
| Parameter | Capability |
| ceramic outer dimension |
tolerance +/- 1% or not less than 0.13 mm |
| cavity dimensions |
tolerance +/- 1% or not less than 0.13 mm |
| ceramic thickness |
tolerance +/- 10% |
| ceramic camber |
0.1 mm/inch |
| ceramic seal path width |
tolerance +/- 1% or not less than 0.13 mm |
| spout position |
tolerance +/- 0.10 mm |
| spout slant vs. ceramic |
//0.05 mm |
| Ni plating |
standard 1.27 ~ 8.89 um |
| Au plating |
standard 1.5 um minimum |
| hermeticity |
He Leak: less than 1 x 10-8atm cc/sec |
