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Hitachi High Technologies America, Inc.

Hitachi

Hitachi Heat Sink

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Hitachi Heat Sink

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Hitachi manufactures Optical Sub-Assemblies (silicon platforms with acid-etched v-grooves and upside pyramidal cavities used for passive alignment of bulk optics/fiber) and Heat Sinks.

The heat sink materials range in thermal conductivity from about 1W/mK (SiO2) up to 270 W/mK (SiC), hence the heat sinks are capable of dissipating heat according to the power consumption of a specific optical device. By selecting a suitable substrate material, it is possible to reduce thermal strain during device assembly. Various types of solder which allow for efficient die bonding are available.

Hitachi High Technologies America is Hitachi's sales and marketing representative for North America.

Advantages:

  • Thin film patterned Titanium Platinum Gold metallization
  • Thin film patterned Gold Tin Solder (or other solders per customer request)
  • Various substrate materials to choose from 

 

Heat Sink Diagram

 


  RangeMinimum
Size		Tolerance
Platform Length (X) X
 0.4 ± 0.05mm
Width (Y) Y
 0.4 ± 0.05 mm
as V Groove OSA Thickness (t) 0.3 ~ 2
± 0.02mm
as Heat Sink Thickness (t)   0.15 ± 0.02mm
SiO2 film thickness
0.3 ~ 1.0
± 10%µm
V-Groove Width (W1) 100 ~ 155
± 0.5µm
Width (W2) 155 ~ 1600
± 2µm
Depth (D1) 70 ~ 109

Depth (D2) 70 ~ 1000

Length Lv

Metallization Pads Structure Ti-Pt-Au

Thickness 0.5 ~ 1.5
± 20%µm
Positioning Tolerance to V-Groove


± 0.5µm
Metallization Traces Structure Ti-Pt-Au

Thickness 0.5 ~ 1.5
± 20%µm
Standard Metal Mask Line Width/Space Distance
200/200
± 50µm
Standard Photolithography Line Width/Space Distance
30/30
± 10µm
Solder Structure Au-Sn
Pb-Sn

Thickness 1 ~ 30
± 20µm
Positioning Tolerance to V-Groove


± 1.5µm

 

Material Properties

SiC AlN Al2O3 SiO2 Si
Bulk density (kg/m3) 3.2 3.3 3.8 2.2 2.3
Thermal Expansion Coefficient (x10-6/K) 3.7 4.5 7.2 0.6 3.5
Thermal Conductivity (W/mxK, RT) 270 170 ~ 200 35 1 145
Volume resistivity (Ohmcm, RT) >1010 >1013 >1013 >1013
Dielectric Constant (1MHz, RT) 100 9.2 10 3.3 11.7
Bending Strength (Mpa, RT) 392 343 294

Heat Sink Materials
SiC (SC-101) Silicon Carbide Ceramic
AlN Aluminum Nitride Ceramic
Al2O3 Alumina Ceramic
SiO2 Synthetic quartz
Si Silicon (crystal, conductive/non-conductive types)